3

Defect detection of flip-chip solder joints using modal analysis

Year:
2012
Language:
english
File:
PDF, 1.97 MB
english, 2012
4

Flip chip solder bump inspection using vibration analysis

Year:
2012
Language:
english
File:
PDF, 689 KB
english, 2012
16

Charging, movement and lifetime characteristics of dust in magnetic fusion devices

Year:
2013
Language:
english
File:
PDF, 326 KB
english, 2013